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REZZ dicing blades are in resin bond, metal bond, vitrified bond and nickel bond. They are performing well, on less burrs, non-clogged and sharp cutting.
MOQ: 5pcs
We designed series of diiamond grinding wheels for semi-condutor industries & Photovoltaic Industry. They include Thinner Grinding Wheels, Dicing Blades, Precision Cutting Wheels and diamond wires. The workpieces are silicon wafers, monocrystalline silicon, Package Singulation, synthetic sapphiers, Alumina ceramics, EMC, PCB. The processing methods are back thinning, rough & fine grinding, edge grinding, dicing, and precision cuttting.
REZZ will provide you with system solutions for industries such as semicondutor & Photovoltaic.
Diamond Features:
* Wear resistance, quality consistency
* High process precision, long life-span
* High speed and high efficiency grinding
* Less damage and good finish of workpiece surface
* Without surface and angle chipping
* Sharp-edged, narrow cutting kerf
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Grinding Methods:
Abrasive |
Diamond, CBN |
Bonding |
Resin, Metal, Vitrified |
Model |
Blades & Wheels |
Grit |
customized |
Popular Sizes |
51-209mm |
MOQ |
5 piece |
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Application:
Grinding Workpiece: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.
Applicable Tool Material: monocrystalline silicon and some other semiconductor materials.
Applicable Grinding Machine: NTS、SHUWA、ENGIS、Okamoto、Disco、TSK，STRASBAUGH.
Specifications:
| Dimensions | ||
| Application | D(mm) | Grit |
| silicon wafer grinding | 102-313mm | As required |
| silicon wafer cutting | 51-56 | |
| Any nonstandard size and grits can customized.(tell me size or drawing is enough) | ||
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