MOQ: 5pcs
At REZZ, we specialize in engineering advanced ceramics grinding wheels that solve the industry’s most pressing challenges—brittle material chipping, excessive tool wear, and compromised surface integrity. Designed explicitly for hard-brittle ceramics like alumina, zirconia, silicon nitride, and silicon carbide, our wheels redefine what’s possible in precision manufacturing across aerospace, medical, semiconductor, and automotive sectors.
REZZ will provide you with system solutions for industries such as zirconia aerospace components grinding, alumina medical implants grinding, or silicon carbide semiconductor wafers grinding. REZZ wheels are custom-tailored to your material’s unique hardness and fracture toughness.
Features:
* Fast grinding, heat reducing quickly.
* Thick diamond layer extends long wheel life.
* High efficiency and high precision.
* Low roughness of work piece surface.
* Excellent profile retaining ability.
* Good self-sharprning and sharp cutting.
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Grinding Methods:
| 1 | Cylindrical Grinding |
| 2 | Centerless Grinding |
| 3 | ID Internal Grinding |
| 4 | Double Face Grinding |
| 5 | Profile Grinding |
| 6 | Cutting |
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Application:
Grinding Workpiece: alumina ceramics, zerconia ceramics, silicon carbide ceramics, silicon nitride ceramics, monocrystalline silicon, etc.
Applicable Tool Material:Aluminum oxide, Zirconium oxide, Steatite and cordierite, Ceramic Insulator Bodies, Electrical Insulator, Fine Advanced Ceramics, Glass Ceramic, Aluminium Nitride, Advanced Ceramic Tubes & Insulators, Silicon nitride, Aluminum nitride, Zirconia, Ceram alloy ultra hard, Alumina Composites, Silicon Nitride, etc.
Applicable Grinding Machine: Cylindrical Grinding Machine, Surface Grinding Machine, Centerless Grinding Machines, ID Grinding Machine, Profile Grinding Machine, Cutting Machines.
Specifications:
| Dimensions | ||||||
| Grinding Method | Model | D(mm) | T(mm) | H(mm) | W(mm) | X(mm) |
| Cylindrical grinding | 1A1, 3A1, 14A1 | 200-900 | 25.4-50.8 | 25.4-304.8 | / | 12.7-20 |
| Centerless grinding | 1A1, 6A1, 9A1 | 125-60 | 50-350 | 75-305 | 5-10 | |
| Internal grinding | 1A1, 1A8, 1A1W | 50.8-200 | 25.4 | As required | As required | |
| Cutting | 1A1R | 10-400 | 0.5-2.0 | 31.75 | 10 | |
| Double face grinding | 1A2, 2A2T | 300-1500 | / | / | 40-350 | 3-10 |
| Profile grinding | As required | |||||
| Any nonstandard size and grits can customized.(tell me size or drawing is enough) | ||||||
| Applications of Advanced Ceramic | * Mechanical. Stainless, red metals and aluminum, bushings, fasteners, seals, valve components, pump parts, battery tooling, wire rollers and more.) * Electronic and Data Storage. toleranced, ultra-thin and ultra-flat ceramic plates for disc drives, glide heads, burnishing heads and substrates for the data storage industry. * Medical. medical,pharmaceutical and food service applications *Semiconductor. Cover Plates, Wafer Carriers, Lift Pins, Edge Rings and Gas Diffusion Plates (GDPs) * LED. Cover Plates, Wafer Carriers, Susceptors and Support Rings * Optics. Mirrors & Telescopes,Optical Mirrors * Medical Devices. Ceramic Implants, Complex Ceramic Assemblies for Surgical Tools, Medical Instrumentation |
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